Call For Papers

IEEE EDSSC 2026 is the 17th in a series of very successful conferences initiated by IEEE ED/SSC Beijing Section Hongkong Chapter. EDSSC 2026 continues the EDSSC tradition as a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the broad areas of electron devices and solid-state circuits and systems. The technical program includes invited talks by famous scientists and contributed papers. All accepted papers will be invited to submit to the IEEE Xplore database, which will be indexed by EI Compendex.


We invite contributions describing the latest scientific and technological results in subjects including but not limited to the following:


  • Nanoelectronics

  • Memory Devices and Tech

  • Photonic Devices

  • RF & Microwave Devices

  • Power Devices

  • Organic Devices

  • Energy Devices

  • Display and Imager

  • MEMS and Sensor

  • EDA and AI

  • Emerging Devices

  • Device Reliability

  • Analog Circuits

  • Biomedical Circuits

  • Data Conversion Circuits

  • Digital and Memory Circuits

  • Power Management Circuits

  • RF & Microwave Circuits

  • Communication Circuits

  • Emerging Devices



Important Dates:

Full Paper Submission Deadline (Previously): March 25, 2026

Full Paper Submission Deadline (Extended): April 15, 2026

Acceptance Notification: April 20, 2026

Early Registration Deadline: May 25, 2026

Conference Dates: June 9-12, 2026



  • 论文评优/Paper Award:

本次会议将进行学生论文评优活动。拟从投稿中遴选出12篇入围论文参与评选,最终评选出6篇优秀学生论文奖。欢迎广大学生学者踊跃投稿参与!

This conference will include a student paper awards selection process. We plan to shortlist 12 papers from the submissions to compete for the award, and ultimately select 6 Outstanding Student Paper Awards. Student scholars are warmly encouraged to submit their papers and participate actively!



Please click to download pdf to obtain the attachment of

2026_EDSSC_CFP.pdf